The primary purpose of bonding all equipment together is to reduce or eliminate a potential difference between conductive materials.

• A. True
• B. False
• C. Not specified
• D. Not applicable

Answer: (A)

Bonding all equipment together creates an equipotential environment where all conductive parts share the same electrical potential. By tying racks, cabinets, enclosures, and other metalwork to a common bonding network, any fault current or stray charges have a low-impedance path back to the source, so voltage differences between conductive materials are minimized. This greatly reduces the risk of shock if a person touches two different surfaces and helps protective devices trip quickly to clear faults. In short, the practice keeps exposed metal at the same potential, preventing hazardous touch voltages and improving fault clearance. Without bonding, different metals could float at different potentials, increasing shock risk and making fault currents harder to manage.